TY - GEN
T1 - A Microfluidic Chip for CTC Whole Genome Sequencing
AU - Ren, Li
AU - Fei, Jia
AU - Zhang, W. K.
AU - Fang, Z. G.
AU - Hu, Z. Y.
AU - Wei, Z. W.
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - This paper developed a microfluidic chip for whole genome sequencing (WGS) of circulating tumor cells (CTC) at single-cell level. For the first time, all processing steps between collecting blood sample and feeding prepared sample to sequencer are finished in a single microfluidic chips. The microfluidic chip comprehensively performs blood filtering, CTC enrichment, CTC identification/isolation, CTC lysis and whole genome amplification (WGA) at the single cell level. The microfluidic chip was validated by clinical samples. Our results demonstrate that for the first time, the aim of 'whole blood in, WGA product out' has been realized at single CTC level with clinical samples, in a microfluidic chip.
AB - This paper developed a microfluidic chip for whole genome sequencing (WGS) of circulating tumor cells (CTC) at single-cell level. For the first time, all processing steps between collecting blood sample and feeding prepared sample to sequencer are finished in a single microfluidic chips. The microfluidic chip comprehensively performs blood filtering, CTC enrichment, CTC identification/isolation, CTC lysis and whole genome amplification (WGA) at the single cell level. The microfluidic chip was validated by clinical samples. Our results demonstrate that for the first time, the aim of 'whole blood in, WGA product out' has been realized at single CTC level with clinical samples, in a microfluidic chip.
UR - http://www.scopus.com/inward/record.url?scp=85074341214&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2019.8870769
DO - 10.1109/MEMSYS.2019.8870769
M3 - Conference contribution
AN - SCOPUS:85074341214
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 412
EP - 415
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -