A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu; L. Pu; Y. Yang; Q. He; Z. Zhou; C. Tan; X. Zhao; Q. Zhang; K. N. Tu

doi:10.1016/j.mtadv.2020.100101

A high-entropy alloy as very low melting point solder for advanced electronic packaging

Y. Liu^*, L. Pu, Y. Yang^*, Q. He, Z. Zhou, C. Tan, X. Zhao, Q. Zhang, K. N. Tu

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Contribution to journal › Article › peer-review

43 Citations (Scopus)

Abstract

SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

Original language	English
Article number	100101
Journal	Materials Today Advances
Volume	7
DOIs	https://doi.org/10.1016/j.mtadv.2020.100101
Publication status	Published - Sept 2020

Keywords

Advanced electronic packaging technology
Diffusion kinetics
High-entropy alloy
Liquid-solid reactions
Pb-free solder

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10.1016/j.mtadv.2020.100101

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@article{1b9e370dce67424db11b2f29931fae0c,

title = "A high-entropy alloy as very low melting point solder for advanced electronic packaging",

abstract = "SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.",

keywords = "Advanced electronic packaging technology, Diffusion kinetics, High-entropy alloy, Liquid-solid reactions, Pb-free solder",

author = "Y. Liu and L. Pu and Y. Yang and Q. He and Z. Zhou and C. Tan and X. Zhao and Q. Zhang and Tu, {K. N.}",

note = "Publisher Copyright: {\textcopyright} 2020 The Author(s)",

year = "2020",

month = sep,

doi = "10.1016/j.mtadv.2020.100101",

language = "English",

volume = "7",

journal = "Materials Today Advances",

issn = "2590-0498",

publisher = "Elsevier Ltd.",

}

TY - JOUR

T1 - A high-entropy alloy as very low melting point solder for advanced electronic packaging

AU - Liu, Y.

AU - Pu, L.

AU - Yang, Y.

AU - He, Q.

AU - Zhou, Z.

AU - Tan, C.

AU - Zhao, X.

AU - Zhang, Q.

AU - Tu, K. N.

PY - 2020/9

Y1 - 2020/9

N2 - SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

AB - SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.

KW - Advanced electronic packaging technology

KW - Diffusion kinetics

KW - High-entropy alloy

KW - Liquid-solid reactions

KW - Pb-free solder

UR - http://www.scopus.com/inward/record.url?scp=85089427079&partnerID=8YFLogxK

U2 - 10.1016/j.mtadv.2020.100101

DO - 10.1016/j.mtadv.2020.100101

M3 - Article

AN - SCOPUS:85089427079

SN - 2590-0498

VL - 7

JO - Materials Today Advances

JF - Materials Today Advances

M1 - 100101

ER -

A high-entropy alloy as very low melting point solder for advanced electronic packaging

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Keywords

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