Ultrafast Mechanism of Material Removal in the Femtosecond Laser Ablation of WS₂ and Its Diode Rectification Characteristics

Engineering

• Rectification 100%
• Material Removal 100%
• Femtosecond Laser Ablation 100%
• Femtosecond Laser 50%
• Computer Simulation 50%
• Transients 50%
• Defects 50%
• Internals 50%
• Optoelectronics 50%
• Laser Energy 50%
• Equation Model 50%
• Raman Spectrum 50%
• Photoelectron 50%
• Coulomb Explosion 50%
• Critical Threshold 50%
• Optoelectronic Device 50%
• Material Response 50%
• Rate Equation 50%
• Phase Explosion 50%
• Forward Bias 50%