Thermal protection materials based on epoxy-containing and phenyl-containing polyhedral oligomeric silsesquioxane modified phenolic resin and phenolic resin/carbon fiber composites
Fan Yang, Jian Li, Wenchao Zhang*, Jiyu He, Rongjie Yang, Jianfeng Huang, Xin Zhang, Wenyuan Zhang
*此作品的通讯作者
科研成果: 期刊稿件 › 文章 › 同行评审
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（Scopus）