Thermal performance analysis based on micro-channel structure of heat sink

H. G. Sun*, Y. Zhou

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Thermal performance determines the normal operation of electronic circuits and power devices. The required cooling capacity is always increasing with the abroad application of electronic system. Especially in high frequency and large power fields, the defection of fan-cooled radiator comes out. By comparison, liquid cooling system possesses better heat stability and conductivity, which not only improves the stability of system, but also reduces the working costs greatly. Cooling capacity of heat sink is mainly determined by the inner mechanical structure, it is necessary to study the different influences of related structure, so as to guide the structural design of heat sink effectively. Based on thermal analysis by changing a single structure parameter, the structural influences on thermal performance are discussed, and the acquired conclusions are of great importance in thermal design practice of heat sink.

源语言英语
主期刊名Advances in Materials Manufacturing Science and Technology XIV
编辑Tian Huang, Dawei Zhang, Bin Lin, Yanling Tian, Weiguo Gao, Anping Xu
出版商Trans Tech Publications Ltd.
579-584
页数6
ISBN(印刷版)9783037852378
DOI
出版状态已出版 - 2012
活动14th International Manufacturing Conference in China, IMCC2011 - Tianjin, 中国
期限: 13 10月 201115 10月 2011

出版系列

姓名Materials Science Forum
697-698
ISSN(印刷版)0255-5476
ISSN(电子版)1662-9752

会议

会议14th International Manufacturing Conference in China, IMCC2011
国家/地区中国
Tianjin
时期13/10/1115/10/11

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