Thermal design and analysis of VO_x microbolometer

Engineering

• Bridge Decks 100%
• Transients 66%
• Large Deformation 66%
• Low-Temperature 33%
• Temperature Field 33%
• Frame Rate 33%
• Thickness Ratio 33%
• Constant Time 33%
• Applied Voltage 33%
• Temperature Rise 33%
• Thermal Radiation 33%
• Layer Structure 33%
• Thermal Simulation 33%
• Equivalent Stress 33%
• Sensing Layer 33%
• Joule Heating Effect 33%

Material Science

• Thermal Analysis 100%
• Large Deformation 66%