Thermal analysis of laser irradiation of fused silica

Peng Yao*, Yadong Gong, Suoxian Yuan, Tianfeng Zhou, Jiwang Yan, Tsunemoto Kuriyagawa

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

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摘要

To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.

源语言英语
主期刊名Advanced Manufacturing Technology
1960-1964
页数5
DOI
出版状态已出版 - 2011
已对外发布
活动2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011 - Guangzhou, 中国
期限: 16 9月 201118 9月 2011

出版系列

姓名Advanced Materials Research
314-316
ISSN(印刷版)1022-6680

会议

会议2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011
国家/地区中国
Guangzhou
时期16/09/1118/09/11

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引用此

Yao, P., Gong, Y., Yuan, S., Zhou, T., Yan, J., & Kuriyagawa, T. (2011). Thermal analysis of laser irradiation of fused silica. 在 Advanced Manufacturing Technology (页码 1960-1964). (Advanced Materials Research; 卷 314-316). https://doi.org/10.4028/www.scientific.net/AMR.314-316.1960