摘要
To grind fused silica in ductile mode, surface and subsurface micro cracks (SSMC) on ground fused silica should be repaired by CO2 laser irradiation before ultra-precision grinding. In this paper, 2D thermal analysis of single pass laser irradiation of fused silica was conducted, and the simulation results were discussed by comparing with the experiment results. To repair SSMC and decrease the surface roughness of ground fused silica simultaneously, the maximum temperature on the surface during laser irradiation should be controlled higher than 3280 K and lower than 3550 K.
源语言 | 英语 |
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主期刊名 | Advanced Manufacturing Technology |
页 | 1960-1964 |
页数 | 5 |
DOI | |
出版状态 | 已出版 - 2011 |
已对外发布 | 是 |
活动 | 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011 - Guangzhou, 中国 期限: 16 9月 2011 → 18 9月 2011 |
出版系列
姓名 | Advanced Materials Research |
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卷 | 314-316 |
ISSN(印刷版) | 1022-6680 |
会议
会议 | 2011 International Conference on Advanced Design and Manufacturing Engineering, ADME 2011 |
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国家/地区 | 中国 |
市 | Guangzhou |
时期 | 16/09/11 → 18/09/11 |
指纹
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Yao, P., Gong, Y., Yuan, S., Zhou, T., Yan, J., & Kuriyagawa, T. (2011). Thermal analysis of laser irradiation of fused silica. 在 Advanced Manufacturing Technology (页码 1960-1964). (Advanced Materials Research; 卷 314-316). https://doi.org/10.4028/www.scientific.net/AMR.314-316.1960