TY - GEN
T1 - The packaging effect on high g accelerometer test
AU - Shi, Yunbo
AU - Zhu, Zhengqiang
AU - Li, Ping
AU - Liu, Jun
PY - 2010
Y1 - 2010
N2 - To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.
AB - To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.
KW - High g acceleration sensor
KW - Modal frequency
KW - Sensor packaging
UR - http://www.scopus.com/inward/record.url?scp=78649277236&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2010.5592255
DO - 10.1109/NEMS.2010.5592255
M3 - Conference contribution
AN - SCOPUS:78649277236
SN - 9781424465439
T3 - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
SP - 720
EP - 722
BT - 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
T2 - 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2010
Y2 - 20 January 2010 through 23 January 2010
ER -