The microstructure and mechanical property of the high entropy alloy as a low temperature solder
Li Pu, Quanfeng He, Yong Yang, Xiuchen Zhao, Zhuangzhuang Hou, K. N. Tu, Yingia Liu
科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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（Scopus）