TY - JOUR
T1 - The Kapitza resistance across grain boundary by molecular dynamics simulation
AU - Tang, Qiheng
AU - Yao, Yugui
PY - 2006/12/1
Y1 - 2006/12/1
N2 - Nonequilibrium molecular dynamics (NEMD) simulations are performed to calculate thermal boundary resistance that arises from heat flow across Si grain boundary. The environment-dependent interatomic potential (EDIP) on crystal silicon is adopted as a model system. The issues are related to nonlinear response, local thermal equilibrium, and statistical averaging. The tilt grain boundaries 5 and 13 are simulated, and the values of thermal boundary resistance by nonequilibrium molecular dynamics are compared with those by Maiti et al. (Solid State Communications, vol. 102, 1997). Using the disperse relation of EDIP potential, an average transmission coefficient of thermal conductivity across boundary is calculated.
AB - Nonequilibrium molecular dynamics (NEMD) simulations are performed to calculate thermal boundary resistance that arises from heat flow across Si grain boundary. The environment-dependent interatomic potential (EDIP) on crystal silicon is adopted as a model system. The issues are related to nonlinear response, local thermal equilibrium, and statistical averaging. The tilt grain boundaries 5 and 13 are simulated, and the values of thermal boundary resistance by nonequilibrium molecular dynamics are compared with those by Maiti et al. (Solid State Communications, vol. 102, 1997). Using the disperse relation of EDIP potential, an average transmission coefficient of thermal conductivity across boundary is calculated.
KW - Grain boundaries
KW - Nonequilibrium molecular dynamics
KW - Phonons
KW - The Kapitza resistance
KW - Thermal conduction
UR - http://www.scopus.com/inward/record.url?scp=34250220643&partnerID=8YFLogxK
U2 - 10.1080/15567260601009239
DO - 10.1080/15567260601009239
M3 - Article
AN - SCOPUS:34250220643
SN - 1556-7265
VL - 10
SP - 387
EP - 398
JO - Nanoscale and Microscale Thermophysical Engineering
JF - Nanoscale and Microscale Thermophysical Engineering
IS - 4
ER -