The Kapitza resistance across grain boundary by molecular dynamics simulation

Qiheng Tang*, Yugui Yao

*此作品的通讯作者

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摘要

Nonequilibrium molecular dynamics (NEMD) simulations are performed to calculate thermal boundary resistance that arises from heat flow across Si grain boundary. The environment-dependent interatomic potential (EDIP) on crystal silicon is adopted as a model system. The issues are related to nonlinear response, local thermal equilibrium, and statistical averaging. The tilt grain boundaries 5 and 13 are simulated, and the values of thermal boundary resistance by nonequilibrium molecular dynamics are compared with those by Maiti et al. (Solid State Communications, vol. 102, 1997). Using the disperse relation of EDIP potential, an average transmission coefficient of thermal conductivity across boundary is calculated.

源语言英语
页(从-至)387-398
页数12
期刊Nanoscale and Microscale Thermophysical Engineering
10
4
DOI
出版状态已出版 - 1 12月 2006
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Tang, Q., & Yao, Y. (2006). The Kapitza resistance across grain boundary by molecular dynamics simulation. Nanoscale and Microscale Thermophysical Engineering, 10(4), 387-398. https://doi.org/10.1080/15567260601009239