The growth and stress vs. strain characterization of the silver solid solution phase with indium

Yongjun Huo*, Chin C. Lee

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

25 引用 (Scopus)

摘要

Silver solid solution phase with indium has been discovered to have great mechanical properties and anti-tarnishing property, as shown in the results of our previous study. It is important to know the stress vs. strain curve before adopting this material in industrial applications. The growth of the homogeneous silver solid solution phase with indium is first described. The X-ray diffraction (XRD) patterns and scanning electron microscope/energy dispersive X-ray spectroscopy (SEM/EDX) results are reported to verify the chemical composition of silver solid solution phase with indium samples. Based on the results, one could reversely determine the indium element composition in (Ag)-xxIn solid solution by examining the lattice constant value using XRD for unknown compositions. The preparation of ASTM tensile test samples and tensile test experimental setting are explained in details. The intrinsic mechanical material properties of silver solid solution phase with indium, i.e., characteristic stress vs. strain curves, are presented and analyzed, with pure silver stress vs. strain curve in comparison. According to the experimental results, silver solid solution phase with indium exhibits low yield strength, high ultimate tensile strength, and large elongation value before fracture, compared to pure silver. In addition, fractography of the fracture surface of the tested sample has been studied to confirm the superior ductility of silver solid solution phase with indium. These superior mechanical properties may bring silver solid solution phase with indium new applications in various industries such as electronics and brazing.

源语言英语
页(从-至)372-379
页数8
期刊Journal of Alloys and Compounds
661
DOI
出版状态已出版 - 15 3月 2016
已对外发布

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