TY - GEN
T1 - The failure of the novel solid MEMS switch in multi-physical coupling field
AU - Fangyi, Liu
AU - Wenzhong, Lou
AU - Ying, Wang
AU - Fufu, Wang
PY - 2014
Y1 - 2014
N2 - The novel solid MEMS switch can improve the performance of the MEMS initiator, which will be more secure and reliable.While the leads of its package are weak under launch environment. Therefore, this paper aims to carry out multi-physical field reliability analysis, by using FEM simulation analysis, which can simulate the real launch environment better and obtain the reliability and potential failure modes of leads in impact, temperature, current coupling field, thus providing theory reference for the design and application of the novel solid MEMS switch.
AB - The novel solid MEMS switch can improve the performance of the MEMS initiator, which will be more secure and reliable.While the leads of its package are weak under launch environment. Therefore, this paper aims to carry out multi-physical field reliability analysis, by using FEM simulation analysis, which can simulate the real launch environment better and obtain the reliability and potential failure modes of leads in impact, temperature, current coupling field, thus providing theory reference for the design and application of the novel solid MEMS switch.
KW - FEM simulation
KW - Failure
KW - Leads
KW - Mems switch
KW - Multi-physical field
UR - http://www.scopus.com/inward/record.url?scp=84900437717&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/KEM.609-610.1404
DO - 10.4028/www.scientific.net/KEM.609-610.1404
M3 - Conference contribution
AN - SCOPUS:84900437717
SN - 9783038350712
T3 - Key Engineering Materials
SP - 1404
EP - 1407
BT - Micro-Nano Technology XV
PB - Trans Tech Publications Ltd.
T2 - 15th Annual Conference and 4th International Conference of the Chinese Society of Micro-Nano Technology, CSMNT 2013
Y2 - 3 November 2013 through 6 November 2013
ER -