The effect of micro-spring stiffness changes on the typical MEMS S&A device

Wang Dakui*, Lou Wenzhong, Xiong Yongjia, Wang Fufu, Liu Fangyi, Jin Xin, Lu Jun

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

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Computer Science

Engineering

Material Science