Temperature analysis of electronic devices for reliability design based on process neural network

Chen Ding*, Zhiling Niu, Muchun Yu, Zijun Zhang, Bingwei Li

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Aiming at reliability design for electronic devices, process neural networks are proposed to predict the temperature of electronic devices. To avoid errors caused by discrete input data fitting or difference, only discrete data is used when solving orthogonal transformation coefficients. To accelerate the learning speed of the gradient descent algorithm, a parameter- independent adaptive learning algorithm is developed. The results show that this model has better accuracy and generalization ability compared with artificial neural networks and linear regression method, and the parameter-independent adaptive learning algorithm has quicker convergence rate compared with parameter-fixed algorithm and adaptive learning algorithm.

源语言英语
主期刊名Proceedings - 2019 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2019
编辑Chuan Li, Shaohui Zhang, Jianyu Long, Diego Cabrera, Ping Ding
出版商Institute of Electrical and Electronics Engineers Inc.
1057-1061
页数5
ISBN(电子版)9781728101996
DOI
出版状态已出版 - 8月 2019
已对外发布
活动2019 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2019 - Beijing, 中国
期限: 15 8月 201917 8月 2019

出版系列

姓名Proceedings - 2019 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2019

会议

会议2019 International Conference on Sensing, Diagnostics, Prognostics, and Control, SDPC 2019
国家/地区中国
Beijing
时期15/08/1917/08/19

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