跳到主要导航
跳到搜索
跳到主要内容
北京理工大学 首页
English
中文
首页
师资队伍
研究单位
科研成果
奖项
按专业知识、名称或附属进行搜索
Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration
Weihua Yu
*
, Abbas Vosoogh, Bowu Wang, Zhongxia Simon He
*
*
此作品的通讯作者
集成电路与电子学院
BIT Chongqing Institute of Microeletronics and Microsystems
Chalmers University of Technology
Beijing Institute of Technology
SinoWave AB
科研成果
:
期刊稿件
›
文章
›
同行评审
4
引用 (Scopus)
综述
指纹
指纹
探究 'Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration' 的科研主题。它们共同构成独一无二的指纹。
分类
加权
按字母排序
Engineering
Waveguide
100%
Monolithic Microwave Integrated Circuits
100%
Millimeter Wave
75%
Terahertz
75%
Mixers (Machinery)
75%
Limitations
25%
Repeatability
25%
Good Agreement
25%
Control Signal
25%
Adaptability
25%
Return Loss
25%
Multiple Sample
25%
Conversion Loss
25%
Earth and Planetary Sciences
Waveguide
100%
Millimeter Wave
100%
Energy Gaps (Solid State)
100%
Broadband
33%
Port
33%
Rectangular Waveguide
33%
Production Cost
33%
Material Science
Waveguide
100%