Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration

Weihua Yu*, Abbas Vosoogh, Bowu Wang, Zhongxia Simon He*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

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Engineering

Earth and Planetary Sciences

Material Science