Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging

Shuang Zhao, Bing Zheng, Donglin Zhang, Xiaochen Xie, Zhibo Qu, Yong Wang, Xiuchen Zhao, Chin C. Lee, Yongjun Huo*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

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Engineering

Material Science

Immunology and Microbiology