TY - GEN
T1 - SMD reliability research base on Stolkarts fatigue model
AU - Wang, Zhao
AU - Zhao, Heming
AU - Lou, Wenzhong
AU - Li, Hanwei
AU - Jin, Li
PY - 2011
Y1 - 2011
N2 - The article mainly focus on the reliability of the solder joints between the PCB and SMD in the situation like transporting and restoring, etc, provide theory evidence to enhance the reliability of such devices, ANSYS simulation tool serviced for modeling PCB, SMD and the joint structures, analyzed the maximum and the minimum stress position of the model, lower stress was loaded on the model to simulate the transferring action, then based on the Stolkarts fatigue model to predict the lifetime of these components, calculated the theory lifetime of the model, compared with the experiment, finally proved that Stolkarts fatigue model has actual ability to calculate the lifetime of devices which under certain stress value.
AB - The article mainly focus on the reliability of the solder joints between the PCB and SMD in the situation like transporting and restoring, etc, provide theory evidence to enhance the reliability of such devices, ANSYS simulation tool serviced for modeling PCB, SMD and the joint structures, analyzed the maximum and the minimum stress position of the model, lower stress was loaded on the model to simulate the transferring action, then based on the Stolkarts fatigue model to predict the lifetime of these components, calculated the theory lifetime of the model, compared with the experiment, finally proved that Stolkarts fatigue model has actual ability to calculate the lifetime of devices which under certain stress value.
UR - http://www.scopus.com/inward/record.url?scp=81355123717&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2011.6066923
DO - 10.1109/ICEPT.2011.6066923
M3 - Conference contribution
AN - SCOPUS:81355123717
SN - 9781457717680
T3 - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
SP - 673
EP - 676
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Y2 - 8 August 2011 through 11 August 2011
ER -