Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics

Xiaofeng Dai, Teng Zhang, Hongbin Shi, Yabing Zhang, Tao Wang*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

15 引用 (Scopus)

指纹

探究 'Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics' 的科研主题。它们共同构成独一无二的指纹。

Material Science

Chemical Engineering