Quantitative-regulated material removal rate in solid dielectric electrochemical polishing (QRR-SDEP) for smoothing high roughness surface of additively manufactured 316L stainless steel components

Shenggui Liu, Chaojiang Li, Xin Jin, Wang Jiang, Xun Cao, Guodong Liu*, Zilong Guo, Yu Xin Yang, Lawrence Chen Lym Ong

*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

5 引用 （Scopus）

指纹

探究 'Quantitative-regulated material removal rate in solid dielectric electrochemical polishing (QRR-SDEP) for smoothing high roughness surface of additively manufactured 316L stainless steel components' 的科研主题。它们共同构成独一无二的指纹。

Material Science

Engineering