Parameter optimization for surface roughness of multiple cut on HS-WEDM based on genetic algorithm

C. J. Li, Y. F. Guo, J. C. Bai, G. Z. Zhu, Z. S. Lu, Y. R. Feng

科研成果: 会议稿件论文同行评审

2 引用 (Scopus)

摘要

High speed wire electrical discharge machining ( HS-WEDM) technique is a kind of original electrical processing technology in China. It has the advantages of low cost and simple fabrication, but its lower surface quality limits its wide utilize. Multiple cut on HS-WEDM technique can improve the machining accuracy and surface roughness. Orthogonal experiment was designed to analyze the most significant factors determining the surface roughness. Lots of single factor experiments were carried out, and formula concerning the significant factors was established and modified by the method of least squares. The best machining parameters in which the best surface roughness were analyzed using genetic algorithm in certain range. This method has high values in the practical use of HS-WEDM.

源语言英语
265-269
页数5
出版状态已出版 - 2010
已对外发布
活动16th International Symposium on Electromachining, ISEM 2010 - Shanghai, 中国
期限: 19 4月 201023 4月 2010

会议

会议16th International Symposium on Electromachining, ISEM 2010
国家/地区中国
Shanghai
时期19/04/1023/04/10

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