On-chip higher-order topological micromechanical metamaterials

Ying Wu, Mou Yan, Zhi Kang Lin, Hai Xiao Wang, Feng Li*, Jian Hua Jiang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

52 引用 (Scopus)

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Engineering

Material Science