TY - GEN
T1 - Numerical simulation of pre-crack propagation in ZrB2-SiC-AlN ceramics subjected to thermal shock
AU - Wan, Xiao Yang
AU - Liang, Jun
AU - Fang, Guo Dong
AU - Wang, Ling Ling
PY - 2014
Y1 - 2014
N2 - The present work examines the pre-indented crack propagation in ZrB2-SiC-AlN ceramics subjected to thermal shock under different temperature differences. A cohesive force model is applied according to the shape and characteristics of the crack in the indentation - quenching experiments. A dimensionless parameter is introduced to characterize the effect of depth on thermal stress which considers the cracks propagate along both the surface and the depth direction. The modified numerical results are 11.3%, 16.6%, 20.8% 27.1% and 64.6% at the quenching temperature differences of 240°C, 280°C, 320°C and 360°C, respectively, which are in good agreement with the experimental results.
AB - The present work examines the pre-indented crack propagation in ZrB2-SiC-AlN ceramics subjected to thermal shock under different temperature differences. A cohesive force model is applied according to the shape and characteristics of the crack in the indentation - quenching experiments. A dimensionless parameter is introduced to characterize the effect of depth on thermal stress which considers the cracks propagate along both the surface and the depth direction. The modified numerical results are 11.3%, 16.6%, 20.8% 27.1% and 64.6% at the quenching temperature differences of 240°C, 280°C, 320°C and 360°C, respectively, which are in good agreement with the experimental results.
KW - Numerical simulation
KW - Pre-crack propagation
KW - Thermal shock
KW - ZrB-SiC-AlN ceramics
UR - http://www.scopus.com/inward/record.url?scp=84891598981&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.833.154
DO - 10.4028/www.scientific.net/AMR.833.154
M3 - Conference contribution
AN - SCOPUS:84891598981
SN - 9783037859193
T3 - Advanced Materials Research
SP - 154
EP - 158
BT - Dianchi Advanced Materials Forum 2013
T2 - 2013 Dianchi Advanced Materials Forum
Y2 - 23 July 2013 through 25 July 2013
ER -