New approach to achieve extremely high thermal conductivity of a powder extruded Al–50Si alloy

Engineering

• Electronic Packaging 33%
• Eutectic Si 33%
• Eutectic Temperature 33%
• Grain Boundary 33%
• Heat Losses 33%
• Heat Treatment Process 33%
• High Thermal Conductivity 100%
• Microstructure 33%
• Packaging Material 33%
• Si Particle 33%
• Subsequent Heat Treatment 33%
• Thermal Conductivity 33%

Material Science

• Electronic Component 25%
• Grain Boundary 25%
• Grain Size 25%
• Heat Treatment 50%
• Ostwald Ripening 25%
• Packaging Material 25%
• Powder 100%
• Thermal Conductivity 100%
• Thermal Property 25%

Chemical Engineering

• Thermal Conductivity 100%