Modulating void action and residual stress variation of composite materials during curing process

Rong Guo Wang; Qiu Tian; Wen You Ma; Cheng Qin Dai; Feng Tian; Yu Jin Chen; Chen Sha Li; Mao Sheng Cao

Modulating void action and residual stress variation of composite materials during curing process

Rong Guo Wang^*, Qiu Tian, Wen You Ma, Cheng Qin Dai, Feng Tian, Yu Jin Chen, Chen Sha Li, Mao Sheng Cao

^*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

4 引用（Scopus）

摘要

It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.

源语言	英语
页（从-至）	95-101
页数	7
期刊	Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
卷	19
期	5
出版状态	已出版 - 10月 2002
已对外发布	是

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@article{4cb58fdc925e4e02b1f8f487c10e24df,

title = "Modulating void action and residual stress variation of composite materials during curing process",

abstract = "It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.",

keywords = "Composites, Cure, Residual stress, Void",

author = "Wang, {Rong Guo} and Qiu Tian and Ma, {Wen You} and Dai, {Cheng Qin} and Feng Tian and Chen, {Yu Jin} and Li, {Chen Sha} and Cao, {Mao Sheng}",

year = "2002",

month = oct,

language = "English",

volume = "19",

pages = "95--101",

journal = "Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica",

issn = "1000-3851",

publisher = "Beijing University of Aeronautics and Astronautics (BUAA)",

number = "5",

}

TY - JOUR

T1 - Modulating void action and residual stress variation of composite materials during curing process

AU - Wang, Rong Guo

AU - Tian, Qiu

AU - Ma, Wen You

AU - Dai, Cheng Qin

AU - Tian, Feng

AU - Chen, Yu Jin

AU - Li, Chen Sha

AU - Cao, Mao Sheng

PY - 2002/10

Y1 - 2002/10

N2 - It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.

AB - It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.

KW - Composites

KW - Cure

KW - Residual stress

KW - Void

UR - http://www.scopus.com/inward/record.url?scp=0038304705&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0038304705

SN - 1000-3851

VL - 19

SP - 95

EP - 101

JO - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

JF - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica

IS - 5

ER -

Modulating void action and residual stress variation of composite materials during curing process

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