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Modeling of coupled temperature-displacement-diffusion problem for silica-phenolic composite under high temperature
Shengbo Shi,
Jun Liang
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此作品的通讯作者
Harbin Institute of Technology
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探究 'Modeling of coupled temperature-displacement-diffusion problem for silica-phenolic composite under high temperature' 的科研主题。它们共同构成独一无二的指纹。
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Engineering
Ablation Process
33%
Conservation Equation
33%
Diffusion Equation
33%
Diffusion Problem
100%
Elastomer
66%
Finite Element Method
33%
Gas-Phase
33%
Gaussians
33%
Heat Flux
33%
Heat Transfer
33%
Mass Transfer
33%
Obtains
33%
Phenolics
100%
Plane Strain
33%
Radiant Heat
33%
Resin Matrix
66%
Strain
33%
Strain State
33%
Stress Field
33%
Temperature Distribution
33%
Material Science
Elastomer
66%
Finite Element Method
33%
Silicon Dioxide
100%
Stress Field
33%
Thermomechanical Property
33%
Thermophysical Property
33%
Transfer Process
33%