Microstructure, residual stress and corrosion resistance in electrodeposited copper foils
Yanhong Hua, Zhihua Nie*, Guojie Huang, Yanfeng Li, Haofeng Xie, Dongmei Liu
*此作品的通讯作者
科研成果: 书/报告/会议事项章节 › 章节 › 同行评审
1
引用
(Scopus)