Microstructure, residual stress and corrosion resistance in electrodeposited copper foils

Yanhong Hua, Zhihua Nie*, Guojie Huang, Yanfeng Li, Haofeng Xie, Dongmei Liu

*此作品的通讯作者

科研成果: 书/报告/会议事项章节章节同行评审

1 引用 (Scopus)

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Material Science