Microstructure and shear properties of interconnect interface between multi-phase heterogeneous SnBi eutectic alloy and Cu substrate

Zhaoteng Dong, Yuhang Wei, Xuefeng Wu, Wei wei Chen, Zhaochen Ran, Shimeng Xu*, Xiuchen Zhao

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

指纹

探究 'Microstructure and shear properties of interconnect interface between multi-phase heterogeneous SnBi eutectic alloy and Cu substrate' 的科研主题。它们共同构成独一无二的指纹。

Material Science