TY - JOUR
T1 - Large-scale flexible and transparent electronics based on monolayer molybdenum disulfide field-effect transistors
AU - Li, Na
AU - Wang, Qinqin
AU - Shen, Cheng
AU - Wei, Zheng
AU - Yu, Hua
AU - Zhao, Jing
AU - Lu, Xiaobo
AU - Wang, Guole
AU - He, Congli
AU - Xie, Li
AU - Zhu, Jianqi
AU - Du, Luojun
AU - Yang, Rong
AU - Shi, Dongxia
AU - Zhang, Guangyu
N1 - Publisher Copyright:
© 2020, The Author(s), under exclusive licence to Springer Nature Limited.
PY - 2020/11
Y1 - 2020/11
N2 - Atomically thin molybdenum disulfide (MoS2) is a promising semiconductor material for integrated flexible electronics due to its excellent mechanical, optical and electronic properties. However, the fabrication of large-scale MoS2-based flexible integrated circuits with high device density and performance remains a challenge. Here, we report the fabrication of transparent MoS2-based transistors and logic circuits on flexible substrates using four-inch wafer-scale MoS2 monolayers. Our approach uses a modified chemical vapour deposition process to grow wafer-scale monolayers with large grain sizes and gold/titanium/gold electrodes to create a contact resistance as low as 2.9 kΩ μm−1. The field-effect transistors are fabricated with a high device density (1,518 transistors per cm2) and yield (97%), and exhibit high on/off ratios (1010), current densities (~35 μA μm−1), mobilities (~55 cm2 V−1 s−1) and flexibility. We also use the approach to create various flexible integrated logic circuits: inverters, NOR gates, NAND gates, AND gates, static random access memories and five-stage ring oscillators.
AB - Atomically thin molybdenum disulfide (MoS2) is a promising semiconductor material for integrated flexible electronics due to its excellent mechanical, optical and electronic properties. However, the fabrication of large-scale MoS2-based flexible integrated circuits with high device density and performance remains a challenge. Here, we report the fabrication of transparent MoS2-based transistors and logic circuits on flexible substrates using four-inch wafer-scale MoS2 monolayers. Our approach uses a modified chemical vapour deposition process to grow wafer-scale monolayers with large grain sizes and gold/titanium/gold electrodes to create a contact resistance as low as 2.9 kΩ μm−1. The field-effect transistors are fabricated with a high device density (1,518 transistors per cm2) and yield (97%), and exhibit high on/off ratios (1010), current densities (~35 μA μm−1), mobilities (~55 cm2 V−1 s−1) and flexibility. We also use the approach to create various flexible integrated logic circuits: inverters, NOR gates, NAND gates, AND gates, static random access memories and five-stage ring oscillators.
UR - http://www.scopus.com/inward/record.url?scp=85091175461&partnerID=8YFLogxK
U2 - 10.1038/s41928-020-00475-8
DO - 10.1038/s41928-020-00475-8
M3 - Article
AN - SCOPUS:85091175461
SN - 2520-1131
VL - 3
SP - 711
EP - 717
JO - Nature Electronics
JF - Nature Electronics
IS - 11
ER -