Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moiré interferometry technique

This paper introduces how to in situ observe fracture behavior around crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moiré interferometry technique. The deformation field induced by electric field concentration near crack tip in three-points bending experiments was measured. By analyzing the moiré interferometry images it is found that strain decreases faster than values predicted by the theoretical analysis as the distance away from the crack tip increases.