Intermittent Fault of Solder Joints: A Review

Gen Liu; Shulin Liu; Yueze Wang; Zijian Zhang; Xiaojian Yi

doi:10.1109/SRSE56746.2022.10067378

Intermittent Fault of Solder Joints: A Review

Gen Liu, Shulin Liu, Yueze Wang, Zijian Zhang, Xiaojian Yi^*

^*此作品的通讯作者

机电学院

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

Intermittent fault caused by solder joints is an important type of intermittent faults. This paper introduces the internal and external inducements of intermittent fault of solder joints, the reproduction technology of intermittent fault, summarizes the diagnosis methods of intermittent fault and research status at home and abroad, and focuses on the diagnosis methods of intermittent fault of solder joints of three packaging modes.

源语言	英语
主期刊名	2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022
出版商	Institute of Electrical and Electronics Engineers Inc.
页	199-206
页数	8
ISBN（电子版）	9781665473880
DOI	https://doi.org/10.1109/SRSE56746.2022.10067378
出版状态	已出版 - 2022
活动	4th International Conference on System Reliability and Safety Engineering, SRSE 2022 - Guangzhou, 中国期限: 15 12月 2022 → 18 12月 2022

出版系列

姓名	2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022

会议

会议	4th International Conference on System Reliability and Safety Engineering, SRSE 2022
国家/地区	中国
市	Guangzhou
时期	15/12/22 → 18/12/22

访问文件

10.1109/SRSE56746.2022.10067378

其它文件与链接

链接到 Scopus 的出版物

引用此

Liu, G., Liu, S., Wang, Y., Zhang, Z., & Yi, X. (2022). Intermittent Fault of Solder Joints: A Review. 在 2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022 (页码 199-206). (2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SRSE56746.2022.10067378

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title = "Intermittent Fault of Solder Joints: A Review",

abstract = "Intermittent fault caused by solder joints is an important type of intermittent faults. This paper introduces the internal and external inducements of intermittent fault of solder joints, the reproduction technology of intermittent fault, summarizes the diagnosis methods of intermittent fault and research status at home and abroad, and focuses on the diagnosis methods of intermittent fault of solder joints of three packaging modes.",

keywords = "fault diagnosis, intermittent fault, reproduction technology, solder joints",

author = "Gen Liu and Shulin Liu and Yueze Wang and Zijian Zhang and Xiaojian Yi",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 4th International Conference on System Reliability and Safety Engineering, SRSE 2022 ; Conference date: 15-12-2022 Through 18-12-2022",

year = "2022",

doi = "10.1109/SRSE56746.2022.10067378",

language = "English",

series = "2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022",

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}

Liu, G, Liu, S, Wang, Y, Zhang, Z & Yi, X 2022, Intermittent Fault of Solder Joints: A Review. 在 2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022. 2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022, Institute of Electrical and Electronics Engineers Inc., 页码 199-206, 4th International Conference on System Reliability and Safety Engineering, SRSE 2022, Guangzhou, 中国, 15/12/22. https://doi.org/10.1109/SRSE56746.2022.10067378

Intermittent Fault of Solder Joints: A Review. / Liu, Gen; Liu, Shulin; Wang, Yueze 等.
2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. 页码 199-206 (2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

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AU - Liu, Shulin

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AB - Intermittent fault caused by solder joints is an important type of intermittent faults. This paper introduces the internal and external inducements of intermittent fault of solder joints, the reproduction technology of intermittent fault, summarizes the diagnosis methods of intermittent fault and research status at home and abroad, and focuses on the diagnosis methods of intermittent fault of solder joints of three packaging modes.

KW - fault diagnosis

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KW - reproduction technology

KW - solder joints

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DO - 10.1109/SRSE56746.2022.10067378

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BT - 2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022

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ER -

Liu G, Liu S, Wang Y, Zhang Z, Yi X. Intermittent Fault of Solder Joints: A Review. 在 2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022. Institute of Electrical and Electronics Engineers Inc. 2022. 页码 199-206. (2022 4th International Conference on System Reliability and Safety Engineering, SRSE 2022). doi: 10.1109/SRSE56746.2022.10067378