Integrated passive devices on through silicon interposer with re-distribution layers

Cheng Jin, Guruprasad Katti, Songbai Zhang

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

2 引用 （Scopus）

指纹

探究 'Integrated passive devices on through silicon interposer with re-distribution layers' 的科研主题。它们共同构成独一无二的指纹。

Engineering