摘要
Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.
源语言 | 英语 |
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主期刊名 | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 |
页 | 755-758 |
页数 | 4 |
DOI | |
出版状态 | 已出版 - 2013 |
活动 | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, 中国 期限: 7 4月 2013 → 10 4月 2013 |
出版系列
姓名 | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 |
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会议
会议 | 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 |
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国家/地区 | 中国 |
市 | Suzhou |
时期 | 7/04/13 → 10/04/13 |
指纹
探究 'High impact-induced failure of a novel solid MEMS switch' 的科研主题。它们共同构成独一无二的指纹。引用此
Ying, W., Lou, W., Yue, Z., & Wang, F. (2013). High impact-induced failure of a novel solid MEMS switch. 在 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (页码 755-758). 文章 6559838 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013). https://doi.org/10.1109/NEMS.2013.6559838