High impact-induced failure of a novel solid MEMS switch

Wang Ying; Wenzhong Lou; Zhao Yue; Fufu Wang

doi:10.1109/NEMS.2013.6559838

High impact-induced failure of a novel solid MEMS switch

Wang Ying^*, Wenzhong Lou, Zhao Yue, Fufu Wang

^*此作品的通讯作者

机电学院

Beijing Institute of Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

3 引用（Scopus）

摘要

Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

源语言	英语
主期刊名	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
页	755-758
页数	4
DOI	https://doi.org/10.1109/NEMS.2013.6559838
出版状态	已出版 - 2013
活动	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, 中国期限: 7 4月 2013 → 10 4月 2013

出版系列

姓名	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

会议

会议	8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
国家/地区	中国
市	Suzhou
时期	7/04/13 → 10/04/13

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10.1109/NEMS.2013.6559838

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引用此

Ying, W., Lou, W., Yue, Z., & Wang, F. (2013). High impact-induced failure of a novel solid MEMS switch. 在 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 (页码 755-758). 文章 6559838 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013). https://doi.org/10.1109/NEMS.2013.6559838

@inproceedings{66cbf4e05e154a45b604fe6d9c626321,

title = "High impact-induced failure of a novel solid MEMS switch",

abstract = "Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.",

keywords = "high impact, leads, reliability, simulation, the novel solid MEMS switch",

author = "Wang Ying and Wenzhong Lou and Zhao Yue and Fufu Wang",

year = "2013",

doi = "10.1109/NEMS.2013.6559838",

language = "English",

isbn = "9781467363525",

series = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013",

pages = "755--758",

booktitle = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013",

note = "8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 ; Conference date: 07-04-2013 Through 10-04-2013",

}

Ying, W, Lou, W, Yue, Z & Wang, F 2013, High impact-induced failure of a novel solid MEMS switch. 在 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013., 6559838, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, 页码 755-758, 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013, Suzhou, 中国, 7/04/13. https://doi.org/10.1109/NEMS.2013.6559838

High impact-induced failure of a novel solid MEMS switch. / Ying, Wang; Lou, Wenzhong; Yue, Zhao 等.
8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013. 2013. 页码 755-758 6559838 (8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - High impact-induced failure of a novel solid MEMS switch

AU - Ying, Wang

AU - Lou, Wenzhong

AU - Yue, Zhao

AU - Wang, Fufu

PY - 2013

Y1 - 2013

N2 - Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

AB - Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

KW - high impact

KW - leads

KW - reliability

KW - simulation

KW - the novel solid MEMS switch

UR - http://www.scopus.com/inward/record.url?scp=84883079672&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2013.6559838

DO - 10.1109/NEMS.2013.6559838

M3 - Conference contribution

AN - SCOPUS:84883079672

SN - 9781467363525

T3 - 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

SP - 755

EP - 758

BT - 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

T2 - 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

Y2 - 7 April 2013 through 10 April 2013

ER -

High impact-induced failure of a novel solid MEMS switch

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