High impact-induced failure of a novel solid MEMS switch

Wang Ying*, Wenzhong Lou, Zhao Yue, Fufu Wang

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

摘要

Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation analysis. Through simulation analysis, the mainly weakness and the potential failure modes of the leads under high impact can be obtained, which can provide theory reference for the design and application of the novel solid MEMS switch.

源语言英语
主期刊名8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
755-758
页数4
DOI
出版状态已出版 - 2013
活动8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013 - Suzhou, 中国
期限: 7 4月 201310 4月 2013

出版系列

姓名8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013

会议

会议8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2013
国家/地区中国
Suzhou
时期7/04/1310/04/13

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