From suppressed void growth to significant void swelling in NiCoFeCr complex concentrated solid-solution alloy

Zhe Fan, Tai ni Yang, Boopathy Kombaiah, Xing Wang, Philip D. Edmondson, Yuri N. Osetsky, Ke Jin, Chenyang Lu, Hongbin Bei, Lumin Wang, Karren L. More, William J. Weber, Yanwen Zhang*

*此作品的通讯作者

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Material Science

Engineering