Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape

Ping Chen, Xiuchen Zhao*, Yong Wang, Ying Liu, Hong Li, Yue Gu

*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

6 引用 （Scopus）

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Engineering

Material Science