Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder

Material Science

• Wettability 100%
• Crystal Structure 50%
• Ultimate Tensile Strength 50%
• Mechanical Strength 50%
• Solid Solution 50%
• Electronic Circuit 50%
• Creep Resistance 50%
• Thermal Property 50%
• Alloying 50%
• Intermetallics 50%
• Thermal Creep 50%