Effects of Ge addition on the growth of interfacial Ni3Sn4 IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations

Shasha Zhang*, Ziting Ye, Yuhang Wei, Bo Sheng, Zhaoteng Dong, Bing Zheng*, Xiuchen Zhao*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

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Material Science