Effects of cobalt nanoparticles addition on shear strength, wettability and interfacial intermetallic growth of Sn−3.0Ag−0.5Cu solder during thermal cycling
Yue Gu, Ying Liu, Xiu Chen Zhao*, Shu Lai Wen, Hong Li, Yuan Wang
*此作品的通讯作者
科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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（Scopus）