Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu-xTiO2 nano-composite solders

Yi Li, Xiuchen Zhao*, Ying Liu, Yuan Wang, Yong Wang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

29 引用 (Scopus)

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Material Science

Engineering