Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Engineering

• Alloying Element 50%
• Creep Property 50%
• Creep Rate 50%
• Creep Resistance 100%
• Dislocation Movement 50%
• Electronic Packaging 50%
• Eutectics 100%
• Grain Boundary Sliding 50%
• Intermetallics 100%
• Microstructure 100%
• Phase Boundary 50%
• Secondary Creep 50%
• Stress Exponent 50%
• Tensiles 50%
• Ultimate Tensile Strength 50%

Material Science

• Alloying 50%
• Creep Property 50%
• Creep Resistance 100%
• Grain Boundary Sliding 50%
• Intermetallics 100%
• Secondary Creep 50%
• Ultimate Tensile Strength 50%