Effect of pad shape on electromigration in solder bump joints

Yi Li, Y. C. Chan*, Xiuchen Zhao

*此作品的通讯作者

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

指纹

探究 'Effect of pad shape on electromigration in solder bump joints' 的科研主题。它们共同构成独一无二的指纹。

Engineering

Material Science