Effect of Bi addition on microstructures, properties and interfacial intermetallic compound growth of Low-Ag Sn-Cu lead-free solder

Yuan Wang, Xiu Chen Zhao*, Ying Liu, Jing Wei Cheng, Hong Li, Xiao Chen Xie

*此作品的通讯作者

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

4 引用 （Scopus）

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Material Science