TY - GEN
T1 - Effect of Ag addition on growth of the interfacial intermetallic compounds between Sn-0.7Cu solder and Cu substrate
AU - Xie, Xiao Chen
AU - Zhao, Xiu Chen
AU - Liu, Ying
AU - Cheng, Jing Wei
AU - Zheng, Bing
AU - Gu, Yue
N1 - Publisher Copyright:
© (2015) Trans Tech Publications, Switzerland.
PY - 2015
Y1 - 2015
N2 - The effect of Ag content on the morphology of the intermetallic compound (IMC) layer at the interface between Sn-xAg-0.7Cu(x=0.0 wt.%, 0.3 wt.%, 0.8 wt.%, 3.0 wt.%) and Cu substrate has been investigated. After reflow, the slight addition of Ag element can suppress the growth of IMC. However, as the Ag content increases, the thickness of IMC is enhanced. After aging at 150℃, the IMC growth rate constant decreases with the addition of Ag. The IMC growth rate constant of Sn-3.0Ag-0.7Cu is 0.94864×10-5 μm2/s, which is the lowest among these solders. As the Ag addition is 0.8wt% and 3.0wt%, the Cu3Sn growth rate constant is 0.16641×10-5 μm2/s and 0.18496×10-5μm2/s, compared to the Sn-0.7Cu solder decreased 54% and 49%, respectively. As a result, the addition of Ag element improves the anti-aging properties and suppresses the growth of Cu3Sn layer, which leads to the improvement of solder joint reliability.
AB - The effect of Ag content on the morphology of the intermetallic compound (IMC) layer at the interface between Sn-xAg-0.7Cu(x=0.0 wt.%, 0.3 wt.%, 0.8 wt.%, 3.0 wt.%) and Cu substrate has been investigated. After reflow, the slight addition of Ag element can suppress the growth of IMC. However, as the Ag content increases, the thickness of IMC is enhanced. After aging at 150℃, the IMC growth rate constant decreases with the addition of Ag. The IMC growth rate constant of Sn-3.0Ag-0.7Cu is 0.94864×10-5 μm2/s, which is the lowest among these solders. As the Ag addition is 0.8wt% and 3.0wt%, the Cu3Sn growth rate constant is 0.16641×10-5 μm2/s and 0.18496×10-5μm2/s, compared to the Sn-0.7Cu solder decreased 54% and 49%, respectively. As a result, the addition of Ag element improves the anti-aging properties and suppresses the growth of Cu3Sn layer, which leads to the improvement of solder joint reliability.
KW - CuSn
KW - Growth rate constant
KW - Intermetallic compounds (IMC)
KW - Sn-Ag-Cu
UR - http://www.scopus.com/inward/record.url?scp=84928662270&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.815.129
DO - 10.4028/www.scientific.net/MSF.815.129
M3 - Conference contribution
AN - SCOPUS:84928662270
T3 - Materials Science Forum
SP - 129
EP - 134
BT - Advanced Functional Materials
A2 - Han, Yafang
A2 - Gu, Zhongwei
A2 - Fu, Qiang
PB - Trans Tech Publications Ltd.
T2 - Chinese Materials Congress, CMC 2014
Y2 - 4 July 2014 through 7 July 2014
ER -