Dynamic Adaptive Variable-Fidelity Modeling Method for BGA Solder Joint Design

Guannan Li, Jingdan Yu, Ru Wang*, Yan Yan

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Currently, building variable-fidelity surrogate models and using dynamic adaptive sampling is becoming a hot research topic in the field of surrogate-based design (SBD). However, due to its unique sample composition, the variable-fidelity model not only needs to consider the acquisition method of sampling points but also the number of samples with different fidelity levels. This poses higher requirements for dynamic adaptive sampling strategies. In this paper, we propose a co-kriging sequential modeling method based on SOM and LHD, which uses the space volume determined by SOM to obtain the sampling number of different fidelity samples. The feasibility of the proposed method was verified using the reliability problem of BGA soldering. Comparing the results obtained by the one-time modeling method for this problem, we discussed the advantages and disadvantages of this approach.

源语言英语
主期刊名Advances in Mechanical Design - The Proceedings of the 2023 International Conference on Mechanical Design, ICMD 2023
编辑Jianrong Tan, Yu Liu, Hong-Zhong Huang, Jingjun Yu, Zequn Wang
出版商Springer Science and Business Media B.V.
723-733
页数11
ISBN(印刷版)9789819709212
DOI
出版状态已出版 - 2024
活动International Conference on Mechanical Design, ICMD 2023 - Chengdu, 中国
期限: 20 10月 202322 10月 2023

出版系列

姓名Mechanisms and Machine Science
155 MMS
ISSN(印刷版)2211-0984
ISSN(电子版)2211-0992

会议

会议International Conference on Mechanical Design, ICMD 2023
国家/地区中国
Chengdu
时期20/10/2322/10/23

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