Design and simulation of MEMS silicon micro-cantilever resonant sensor

Chengjun Qiu*, Dan Bu, Wei Qu, Maosheng Cao

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

A silicon resonant sensor with micro-cantilever structure based on MEMS technology is investigated. According to the principle of MEMS silicon micro-cantilever resonant sensor, the structure of sensor is designed and the locations of thermal excited and detected resistors are fixed respectively. With the IntelliSuite software, the dynamic characteristics are analyzed, and the relationship between dimensions and inherent frequency of resonant sensor is discussed. The conclusion shows that the inherent frequency is independent of cantilever width, but proportional to thickness directly. And also it shows a nonlinear proportional to length inversely. Furthermore, a feasible fabrication technology is made through experiment research. In order to acquire a perfectly micro-cantilever structure, a corner undercutting compensation is applied in KOH anisotropic etching, and the effect of compensation is well. Thus, the process periods decreases greatly by the simulation, the design result and quality are improved effectively, and it is useful to the actual production for MEMS sensors.

源语言英语
主期刊名International Conference on Smart Materials and Nanotechnology in Engineering
DOI
出版状态已出版 - 2007
活动International Conference on Smart Materials and Nanotechnology in Engineering - Harbin, 中国
期限: 1 7月 20074 7月 2007

出版系列

姓名Proceedings of SPIE - The International Society for Optical Engineering
6423
ISSN(印刷版)0277-786X

会议

会议International Conference on Smart Materials and Nanotechnology in Engineering
国家/地区中国
Harbin
时期1/07/074/07/07

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