跳到主要导航
跳到搜索
跳到主要内容
北京理工大学 首页
English
中文
首页
师资队伍
研究单位
科研成果
奖项
按专业知识、名称或附属进行搜索
Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications
Jiajie Yang,
Lixin Xu
*
, Ke Yang
*
此作品的通讯作者
机电学院
Beijing Institute of Technology
科研成果
:
期刊稿件
›
文章
›
同行评审
综述
指纹
指纹
探究 'Design and Optimization of a Fan-Out Wafer-Level Packaging- Based Integrated Passive Device Structure for FMCW Radar Applications' 的科研主题。它们共同构成独一无二的指纹。
分类
加权
按字母排序
Engineering
Frequency Modulated Continuous Wave
100%
Device Structure
100%
Level Packaging
100%
Passive Device
100%
Continuous Wave Radar
100%
Metrics
50%
Noise Figure
50%
Computation Time
25%
Radar Systems
25%
Antenna
25%
Genetic Algorithm
25%
Millisecond
25%
Passive Component
25%
Front End
25%
Loss Function
25%
Support Vector Machine
25%