Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

Engineering

• Microelectromechanical System 100%
• Axis Accelerometer 100%
• Thin Films 50%
• Side Wall 50%
• Finite Element Simulation 50%
• Wafer Bonding 50%
• Noise Floor 50%
• Interconnects 50%
• Micro Machining 50%
• Metal Layer 50%
• Step Etch 50%

Material Science

• Microelectromechanical System 100%
• Accelerometer 100%
• Finite Element Method 50%
• Thin Film Structure 50%
• Capacitor 50%
• Micromachining 50%