Comparative study on the hourglass-like joint of electroplated Sn-base solder reinforced by adding Ag3Sn nanoparticles and Ag micro-alloying elements
Zhuangzhuang Hou, Xiuchen Zhao*, Ying Liu, Chengwen Tan, Yue Gu
*此作品的通讯作者
科研成果: 期刊稿件 › 文章 › 同行评审
11
引用
（Scopus）