摘要
Elliptic ultrasonic vibration-assisted grinding has been proven to be a high-efficiency machining technique for some brittle materials. This paper aims to investigate the chip generating characteristics in grinding of brittle materials with vertical elliptic vibration assistance. Vertical elliptic ultrasonic vibration-assisted grinding for precision machining brittle polysilicon is suggested and tested. The mechanism of chip generation and characteristics of surfaces in ductile mode, machined by ultrasonic vibration-assisted grinding, are investigated. As a result, when microgrinding by ultrasonic vibration, it was confirmed that the continuous chips generated by ductile mode can be more easily be fully developed.
| 源语言 | 英语 |
|---|---|
| 页（从-至） | 563-568 |
| 页数 | 6 |
| 期刊 | International Journal of Advanced Manufacturing Technology |
| 卷 | 62 |
| 期 | 5-8 |
| DOI | |
| 出版状态 | 已出版 - 9月 2012 |
指纹
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Peng, Y., Liang, Z., Wu, Y., Guo, Y., & Wang, C. (2012). Characteristics of chip generation by vertical elliptic ultrasonic vibration-assisted grinding of brittle materials. International Journal of Advanced Manufacturing Technology, 62(5-8), 563-568. https://doi.org/10.1007/s00170-011-3839-8