TY - JOUR
T1 - Analysis of piezoelectric fracture under combined mechanical and electrical loading based on meshless method
AU - Guo, Xianghua
AU - Fang, Daining
PY - 2004
Y1 - 2004
N2 - In this paper, the moving least-square (MLS) method, one of the most promising meshless methods, is modified to construct whole field meshless approximation for coupled electromechanical problems. Based on this method, the crack propagation behavior and the elasto-electric fields near a crack tip in a PZT-5H piezoelectric ceramic under mechanical, electrical and mechanical-electrical mixed loads are investigated. The numerical results show that for a negative applied electric field, the hoop stress will be maximum at a certain angle other than 00 when the ratio of the electric field to tensile stress is relatively high, which makes the crack turn away from its original growth path.
AB - In this paper, the moving least-square (MLS) method, one of the most promising meshless methods, is modified to construct whole field meshless approximation for coupled electromechanical problems. Based on this method, the crack propagation behavior and the elasto-electric fields near a crack tip in a PZT-5H piezoelectric ceramic under mechanical, electrical and mechanical-electrical mixed loads are investigated. The numerical results show that for a negative applied electric field, the hoop stress will be maximum at a certain angle other than 00 when the ratio of the electric field to tensile stress is relatively high, which makes the crack turn away from its original growth path.
KW - Fracture mechanics
KW - MLS
KW - Meshless method
KW - Piezoelectric material
UR - http://www.scopus.com/inward/record.url?scp=3142708056&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:3142708056
SN - 1013-9826
VL - 261-263
SP - 543
EP - 548
JO - Key Engineering Materials
JF - Key Engineering Materials
IS - I
T2 - Advances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF)
Y2 - 20 October 2003 through 22 October 2003
ER -