Analyse of the structure of high g-force MEMS accelerometer

Ping Song; Kejie Li; Gengchen Shi

doi:10.1117/12.440208

Analyse of the structure of high g-force MEMS accelerometer

Ping Song^*, Kejie Li, Gengchen Shi

^*此作品的通讯作者

机电学院

Beijing Institute of Technology

科研成果: 期刊稿件 › 会议文章 › 同行评审

摘要

The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

源语言	英语
页（从-至）	273-275
页数	3
期刊	Proceedings of SPIE - The International Society for Optical Engineering
卷	4414
DOI	https://doi.org/10.1117/12.440208
出版状态	已出版 - 2001
活动	International Conference on Sensor Technology (ISTC 2001) - Wuhan, 中国期限: 10 10月 2001 → 12 10月 2001

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Song, P., Li, K., & Shi, G. (2001). Analyse of the structure of high g-force MEMS accelerometer. Proceedings of SPIE - The International Society for Optical Engineering, 4414, 273-275. https://doi.org/10.1117/12.440208

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AB - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.

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KW - MEMS accelerometer

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Analyse of the structure of high g-force MEMS accelerometer

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