TY - JOUR
T1 - Analyse of the structure of high g-force MEMS accelerometer
AU - Song, Ping
AU - Li, Kejie
AU - Shi, Gengchen
PY - 2001
Y1 - 2001
N2 - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.
AB - The structure of high g-force microelectromechanical accelerometer was analyzed. These acceleorometers are fabricated using bulk-micromachining, surface micromachining, LIGA technologies, etc. Damping, packaging and mechanical structure are three main factors of a high g-force MEMS accelerometers. The sensing methods of these accelerometers involve piezoresistive, capacitive, piezoelectric, acoustic and optical sensing.
KW - High g-force
KW - MEMS accelerometer
UR - http://www.scopus.com/inward/record.url?scp=0035759430&partnerID=8YFLogxK
U2 - 10.1117/12.440208
DO - 10.1117/12.440208
M3 - Conference article
AN - SCOPUS:0035759430
SN - 0277-786X
VL - 4414
SP - 273
EP - 275
JO - Proceedings of SPIE - The International Society for Optical Engineering
JF - Proceedings of SPIE - The International Society for Optical Engineering
T2 - International Conference on Sensor Technology (ISTC 2001)
Y2 - 10 October 2001 through 12 October 2001
ER -